CoE

Cooling of electronics

Information

Introductory course on thermal design and cooling of electronic components, modules and systems.

 

To prevent expensive redesigns and a delayed market introduction, thermal management needs to be part of the design process from the early start. This course introduces thermal design and cooling of electronic components, modules and systems from an industrial point of view. This view is relevant for many applications, such as semiconductors, power electronics, and recently lighting through the accelerated introduction of LEDs. Two very experienced lecturers learn the participants to solve the thermal problems they encounter during all levels of the product creation process. The course is a balanced mixture between theory and practice. The participants are requested to fill in an intake form such that the lecturers can make use of knowledge of their background during the course. Real-life cases obtained from participants themselves and prepared by the lecturers are used to demonstrate the application of the course principles during the final day.

 

After the course, the participants will have mastered basic knowledge on:

- physics of heat transfer;

- thermal specifications and requirements;

- numerical and experimental solutions;

- timely ways of working.

Intended for

Engineers directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, or those who simply want to understand and learn more about this important subject. Prerequisites: technical college/university education.

Programme

Miniaturization and/or integration of more and more functionality in products cause(s) a significant increase in power density and therefore higher temperature levels in products. High temperatures have a negative influence on performance, reliability and safety. Because early knowledge of potential thermally related problems is imperative to reduce redesigns and time-to-market, thermal management should be integrated in the product design process.

 

The final half day is spent on a case study during which the thermal know-how is applied.

• Theory of heat transfer mechanisms
• Exercises
• Thermal specifications and requirements, reliability issues
• Timely ways of working
• Rules-of-thumb
• Hand calculations
• Numerical analysis
• Overview of (advanced) cooling technologies
• Practical examples
• Experimental analysis
• Discussion of practical problems delivered by attendees
• Case studies

  

Methods: A balanced mixture between lectures, exercises and a case study. Course material: lecture notes, booklet on thermal management. Award: certificate.

Timetable

07-11-2012 09:00
08-11-2012 09:00
09-11-2012 09:00