Photo by: Bart van Overbeeke
Industry trends towards ever increasing functionality, performance, miniaturization, and less cost result in higher heat density and corresponding higher temperatures. Unfortunately, these have a negative impact on the performance, reliability and lifetime of electronic products, and make thermal design more challenging than ever.
Two very experienced lecturers, Wendy Luiten (winner of the prestigious Harvey Rosten Award 2014) and Clemens Lasance (a.o. SEMI-THERM THERMI Award winner in 2001), teach the participants how to solve the thermal problems inherent in electronics thermal management today. Based on a combined 75-plus years of industrial thermal design experience they present a balanced mix of theory and practice. The course focusses on recognition and prevention of thermal problems through optimal thermal design and architecture choices in all stages of the industrial product creation process – avoiding re-design, delayed time-to-market and associated costs in time and resources. On the third day, participants practice the acquired thermal know-how by solving a real life case of the current or previous participants.
Read the interview with Wendy Luiten: Designing cooling-architecture for electronics is very similar to high-level puzzle solving
€ 1.700,00 excl. VAT
3 consecutive days
How participants recommend this training to others:
(average score of last 3 editions)
13-05-2019 | 09:00 - 17:00
14-05-2019 | 09:00 - 17:00
15-05-2019 | 09:00 - 17:00
This course discusses the why, what and how of thermal management and thermal design in all phase...
This course discusses the why, what and how of thermal management and thermal design in all phases of the industrial product design process. It gives concrete guidelines to make the right thermal design choices on component, module and system level. This knowledge is relevant for many electronic applications, such as consumer electronics, semiconductors, power electronics, LED applications, automotive, data centers etc.
After the course, the participant:
Engineers (electronic, mechanical/mechatronic, reliability) directly involved with thermal design...
Engineers (electronic, mechanical/mechatronic, reliability) directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, Thermal Engineers, System Architects, or those who want to understand and learn more about this subject of growing importance due to the electronification of society, be it automotive, LEDs, Internet-of-Things or data centers.
Prerequisites: technical college/university education.
One or two weeks before the course starts the participants are requested to complete a form to allow the lecturers to tailor the course to the audience.
The course is designed in such a way that both engineers with hardly any thermal knowledge and en...
The course is designed in such a way that both engineers with hardly any thermal knowledge and engineers with many years of thermal experience can benefit.
On four different moments during the course, the participant can choose to deepen understanding of the presented material OR to do a hands-on application exercise on an industry relevant example. The four choice modules are:
Day 1, AM:
Day 1, PM:
Day 2, AM:
Day 2, PM:
Day 3, AM:
Day 3, PM:
Classroom lectures, classroom and group demonstrations and exercises and a group case study.
Course material: lecture notes, book Heat Transfer Theory applied to Electronics Cooling by Lasance & Luiten.
Participants receive a HTI certificate....
Participants receive a HTI certificate.
'Most important items I’ve learned: basics about heat transfer, hand calculations, thermal design walkthrough.'
'Very relaxing, open atmosphere. Good feedback between lecturers & class.'
'Good course with good combination of instructors.'
November 2018 edition:
Claim your spot in the next edition.