Thermal design and cooling of electronics workshop

01-05-2017

Location:Eindhoven
Price:€ 1.650,00 excl. VAT
Duration:3 consecutive days (1 - 3 May 2017)
Contact:training@hightechinstitute.nl, +31 85 401 3600

Overview

Industry trends towards ever increasing functionality, performance, miniaturization, and less cost result in higher heat density and corresponding higher temperatures. Unfortunately, these have a negative impact on the performance, reliability and lifetime of electronic products, and make thermal design more challenging than ever.


Two very experienced lecturers, Wendy Luiten (winner of the prestigious Harvey Rosten Award 2014) and Clemens Lasance (a.o. SEMI-THERM THERMI Award winner in 2001), teach the participants how to solve the thermal problems inherent in electronics thermal management today. Based on a combined 75-plus years of industrial thermal design experience they present a balanced mix of theory and practice.  The course focusses on recognition and prevention of thermal problems through optimal thermal design and architecture choices in all stages of the industrial product creation process – avoiding re-design, delayed time-to-market and associated costs in time and resources. On the third day, participants practice the acquired thermal know-how by solving a real life case of the current or previous participants.

Objective

This course discusses the why, what and how of thermal management and thermal design in all phases of the industrial product design process. It gives concrete guidelines to make the right thermal design choices on component, module and system level. This knowledge is relevant for many electronic applications, such as consumer electronics, semiconductors, power electronics, LED applications, automotive, data centers etc.

 

After the course, the participant:

  • has obtained a basic understanding of heat transfer phenomena.
  • knows how to apply this knowledge in practice.
  • is able to make the right thermal design choices on component, module and system level
  • knows to estimate when a thermal expert needs to be consulted.
  • is able to communicate with thermal experts.
  • Is able to estimate the impact of system architecture, mechanical dimensions, material properties and heat dissipations on critical temperatures

Intended for

Engineers (electronic, mechanical/mechatronic, reliability) directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, Thermal Engineers, System Architects, or those who want to understand and learn more about this subject of growing importance due to the electronification of society, be it automotive, LEDs, Internet-of-Things or data centers.

Prerequisites: technical college/university education. 

One or two weeks before the course starts the participants are requested to complete a form to allow the lecturers to tailor the course to the audience.

Programme

The course is designed in such a way that both engineers with hardly any thermal knowledge and engineers with many years of thermal experience can benefit.

On four different moments during the course, the participant can choose to deepen understanding of the presented material OR to do a hands-on application exercise on an industry relevant example. The four choice modules are:

  • Exercises on fundamentals of heat transfer using the electrothermal analogue OR advanced heat transfer
  • Exercises on heating & fan cooling OR advanced thermal characterization
  • How to do numerical analysis OR advanced numerical analysi
  • How to do measurements OR advanced measurement


Day 1, AM:

  • Conduction -, convection - and radiation heat transfer
  • Choice module 1
  • Heat spreading


Day 1, PM:

  • Heating & Cooling
  • Fan cooling
  • Reliability issues
  • Specifications and thermal requirements
  • Thermal characterization
  • Choice module 2


Day 2, AM:

  • Thermal way of working
  • Thermal rules-of-thumb
  • Hand calculations
  • Heat sink exercise


Day 2, PM:

  • Problem solving example
  • Sources of information
  • Numerical analysis
  • Choice module 3
  • Measurement techniques
  • Choice module 4


Day 3, AM:

  • Cooling solutions
  • Liquid cooling
  • Advanced cooling technologies


Day 3, PM:

  • Case study

Methods

Classroom lectures, classroom and group demonstrations and exercises and a group case study.
Course material: lecture notes, book Heat Transfer Theory applied to Electronics Cooling by Lasance & Luiten.

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T2Prof

Certification

Participants receive a HTI certificate.

References

‘‘Most important items I’ve learned: basics about heat transfer, hand calculations, thermal design walkthrough.” – Lars Keller (Continental Automotive)
‘‘Very relaxing, open atmosphere. Good feedback between lecturers & class.” – Thady Bruton (NXP Semiconductors)
‘‘Good course with good combination of instructors.” – Abdulaziz Al Hussain (Advanced Electronics Company)

Timetable

01-05-2017 09:00
02-05-2017 09:00
03-05-2017 09:00

Thermal design and cooling of electronics workshop

Location:
Eindhoven
Contact:
Tel. +31 85 401 3600
E-mail: training@hightechinstitute.nl

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