Thermal design and cooling of electronics workshop
Price:€ 1.650,00 excl. VAT
Duration:3 consecutive days
Contact:firstname.lastname@example.org, +31 85 401 3600
Experienced lecturers Wendy Luiten (winner of the Prestigious Harvey Rosten Award 2014) and Clemens Lasance (SEMI-THERM THERMI Award winner in 2001) learn the participants to solve the thermal problems they encounter during all levels of the product creation process. The course is a balanced mixture between theory and practice. The participants are requested to fill in an intake form such that the lecturers can make use of knowledge of their background during the course. A real-life case obtained from the participants themselves and prepared by the lecturers is used to demonstrate the application of the course principles during the final day.
To prevent expensive redesigns and a delayed market introduction, thermal management needs to be part of the design process from the early start. This course discusses the why, what and how of thermal management and thermal design in all phases of the (electronic and mechanical/mechatronic) product design process, and from an industrial point of view. It gives the electronic and mechanical/mechatronic designer concrete guide lines to make the right thermal design choices on system, module and component level. This view is relevant for many applications, such as semiconductors, power electronics, the accelerated introduction of LEDs in lamps. The relevance is recently underlined by various thermal failure accidents.
Engineers (electronic and mechanical/mechatronic) directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, or those who simply want to understand and learn more about this important subject. Also experienced engineers can benefit a lot from this course because e.g. many facts of experience can fall into place. Prerequisites: technical college/university education. Since this course helps in recognizing and preventing potential thermal problems and therefore can prevent expensive redesigns and a delayed market introduction, it is advised to attend this course in an early start of the design process.
Miniaturization and/or integration of more and more functionality in products cause(s) a significant increase in power density and therefore higher temperature levels in products. High temperatures have a negative impact on performance, reliability and safety. Because early knowledge of potential thermally related problems is imperative to reduce redesigns and time-to-market, thermal management should be integrated in the product design process. The final half day of the course is used to learn apply the discussed thermal know-how.
- Conduction -, convection - and radiation heat transfer
- Heat spreading
- Heating & Cooling
- Reliability issues
- Thermal characterization
- Specifications and thermal requirements
- Fan cooling
- Thermal way of working
- Thermal rules-of-thumb
- Hand calculations
- Break & heat sink exercise
- Problem solving example
- Numerical analysis
- Measurement techniques for thermal management
- Cooling solutions
- Advanced cooling technologies
- Case study
A balanced mixture between lectures, exercises and a case study.
Course material: lecture notes, booklet on thermal management.
Participants receive a HTI certificate.
‘‘Most important items I’ve learned: basics about heat transfer, hand calculations, thermal design walkthrough.” – Lars Keller (Continental Automotive)
‘‘Very relaxing, open atmosphere. Good feedback between lecturers & class.” – Thady Bruton (NXP Semiconductors)
‘‘Good course with good combination of instructors.” – Abdulaziz Al Hussain (Advanced Electronics Company)