Introduction to and history of IC technology, simple process flow (1 x 3 hrs)
Semiconductor devices and device physics (5 x 3 hrs)
- Distribution and transport of charge carriers in semiconductors;
- Semiconductor fundamentals;
- PN junction diode;
- MOSFET transistors;
- Bipolar transistors;
- Small and large signal behavior, first and second order effects;
- Relation between the semiconductor technology and the behavior of the devices.
MOS and bipolar IC processing (5 x 3 hrs)
- Oxidation;
- Diffusion;
- Ion implantation;
- Chemical vapor deposition (CVD);
- Physical vapor deposition (PVD);
- Wet processing;
- Plasma etching;
- Photo lithography.
Several advanced topics (like high-K, SOI, FinFET) will be addressed briefly in the device physics / technology part: What are the essentials, the (dis) advantages and consequences.
Electrical process characterization and monitoring (2 x 3 hrs):
- Probe pads, PCMs (Process Control Monitor), PEMs (Process Evaluation Monitor);
- Measurement systems & SMUs (Source-Measure-Unit);
- Resistance measurements;
- Single layer sheet resistance evaluation and characterization;
- Test structures for inter- and intra-layer isolation;
- Contact resistance characterization.
Concluding session (1 x 3 hrs):
- Current developments on device physics, semiconductor devices and process technology;
- Homework, certificates and evaluation.
