Rationale
New technical developments with increased thermal challenges necessitate the use of more advanced thermal management strategies. In data centers, cloud and AI drive single component dissipations to unprecedented heights. In the energy sector high power electric conversion leads to high heat losses in switching elements, and the same happens in variable drives in machinery and transportation applications. Unless thermal management is addressed, high heat results in higher component temperatures and an increased risk for reduced performance, reliability and lifetime. In some circumstances use of fan cooled large heatsinks is sufficient, but often a switch to liquid cooling is needed.
Advanced methods of electronics cooling is presented by Wendy Luiten, winner of the prestigious 2024 Thermi award for Significant Contributions to Thermal Management of Semiconductors, and the 2014 Harvey Rosten award for excellent advances in thermal analysis of electronics. Luiten has extensive industrial thermal design experience in consumer electronics, lighting, medical, semiconductor, mechatronics, aerospace and defense industry, and is a well-known expert in the electronics cooling community.
Advanced thermal management of electronics (COE-ADV; lecturer Wendy Luiten)
This module is organized as a 4 half-days online module (via Microsoft Teams). It is intended for engineers familiar with at least the contents of the Electronics Cooling Thermal Design design module and builds further on its contents.
This advanced training is available for open enrollment as well as for in-company sessions. For in-company sessions, the training can be adapted, for instance by adding a tailor-made case study or an extra practice day (both at an additional cost).