Thermal design and cooling of electronics training

Rationale
Industry moves towards ever increasing functionality, performance, miniaturization and less cost, resulting in higher heat densities and corresponding higher temperatures. Unfortunately, these have a negative impact on the performance, reliability and lifetime of electronic products, making thermal design more challenging than ever. Optimization of thermal design is relevant for many electronic applications, such as consumer electronics, semiconductors, power electronics, LED applications, automotive, data centers, internet of everything, digital twins etc.

Two very experienced lecturers, Wendy Luiten (winner of the prestigious Harvey Rosten Award 2014) and Clemens Lasance (a.o. SEMI-THERM THERMI Award winner in 2001), teach the participants how to solve the thermal problems inherent in electronics thermal management today. Based on a combined 75-plus years of industrial thermal design experience, they present a balanced mix of theory and practice.

The course is designed in such a way that both engineers with hardly any thermal knowledge and engineers with many years of thermal experience can benefit. On four different moments during the course, the participants can choose to deepen their understanding of the presented material OR to do a hands-on application exercise on an industrial relevant example. They can choose during the course right before the selection moments.

On the third day, participants practice the acquired thermal know-how by solving a real life case of current or previous participants.

The course focuses on recognition and prevention of thermal problems through optimal thermal design and architecture choices in all stages of the industrial product creation process – avoiding re-design, delayed time-to-market and associated costs in time and resources. It gives concrete guidelines to make the right thermal design choices on component, module and system level. 

After the course, the participant:

• has obtained a basic understanding of heat transfer phenomena;
• knows how to apply this knowledge in practice;
• is able to make the right thermal design choices on component, module and system level;
• knows to estimate when a thermal expert needs to be consulted;
• is able to communicate with thermal experts;
• Is able to estimate the impact of system architecture, mechanical dimensions, material properties and heat dissipations on critical

Engineers (electronic, mechanical/mechatronic, reliability) directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, Thermal Engineers, System Architects, or those who want to understand and learn more about this subject of growing importance due to the electronification of society, be it automotive, LEDs, Internet-of-Things or data centers.

Prerequisites: technical college/university education.

The course can also be organized in-company, adapted to local needs.