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Beschreibung auch in Deutsch verfügbar

Electronics - Cooling

Photo by: Bart van Overbeeke

Course overview

Industry trends towards ever increasing functionality, performance, miniaturisation, and less cost result in higher heat density and corresponding higher temperatures. Unfortunately, these have a negative impact on the performance, reliability and lifetime of electronic products, and make thermal design more challenging than ever.

Two very experienced lecturers, Wendy Luiten (winner of the prestigious Harvey Rosten Award 2014) and Clemens Lasance (a.o. SEMI-THERM THERMI Award winner in 2001), teach the participants how to solve the thermal problems inherent in electronics thermal management today. Based on a combined 75-plus years of industrial thermal design experience they present a balanced mix of theory and practice.  The course focusses on recognition and prevention of thermal problems through optimal thermal design and architecture choices in all stages of the industrial product creation process – avoiding re-design, delayed time-to-market and associated costs in time and resources. On the third day, participants practice the acquired thermal know-how by solving a real life case of the current or previous participants.

Read the interview with lecturer Wendy Luiten: 
'Designing cooling-architecture for electronics is very similar to high-level puzzle solving'.


€ 1.700,00 excl. VAT


3 consecutive days




How participants recommend this training to others:
(average score of last 3 editions)


12-05-2020 | 09:00 - 17:00
13-05-2020 | 09:00 - 17:00
14-05-2020 | 09:00 - 17:00

Next editions


This course discusses the why, what and how of thermal management and thermal design in all phases of the industrial product design process. It gives concrete guidelines to make the right thermal design choices on component, module and system level. This knowledge is relevant for many electronic applications, such as consumer electronics, semiconductors, power electronics, LED applications, automotive, data centers etc.

After the course, the participant:

  • has obtained a basic understanding of heat transfer phenomena;
  • knows how to apply this knowledge in practice;
  • is able to make the right thermal design choices on component, module and system level;
  • knows to estimate when a thermal expert needs to be consulted;
  • is able to communicate with thermal experts;
  • Is able to estimate the impact of system architecture, mechanical dimensions, material properties and heat dissipations on critical temperatures.

vIntended for

Engineers (electronic, mechanical/mechatronic, reliability) directly involved with thermal design and cooling of electronic components, modules and systems, engineers confronted with thermal problems/issues, Thermal Engineers, System Architects, or those who want to understand and learn more about this subject of growing importance due to the electronification of society, be it automotive, LEDs, Internet-of-Things or data centers.

Prerequisites: technical college/university education.

One or two weeks before the course starts the participants are requested to complete a form to allow the lecturers to tailor the course to the audience.


The course is designed in such a way that both engineers with hardly any thermal knowledge and engineers with many years of thermal experience can benefit.

On four different moments during the course, the participant can choose to deepen understanding of the presented material OR to do a hands-on application exercise on an industry relevant example. The four choice modules are:

  • Exercises on fundamentals of heat transfer using the electrothermal analogue OR advanced heat transfer
  • Exercises on heating & fan cooling OR advanced thermal characterisation
  • How to do numerical analysis OR advanced numerical analysis
  • How to do measurements OR advanced measurement

Day 1, AM:

  • Conduction -, convection - and radiation heat transfer
  • Choice module 1
  • Heat spreading

Day 1, PM:

  • Heating & Cooling
  • Fan cooling
  • Reliability issues
  • Specifications and thermal requirements
  • Thermal characterisation
  • Choice module 2

Day 2, AM:

  • Thermal way of working
  • Thermal rules-of-thumb
  • Hand calculations
  • Heat sink exercise

Day 2, PM:

  • Problem solving example
  • Sources of information
  • Numerical analysis
  • Choice module 3
  • Measurement techniques
  • Choice module 4

Day 3, AM:

  • Cooling solutions
  • Liquid cooling
  • Advanced cooling technologies

Day 3, PM:

  • Case study


Classroom lectures, classroom and group demonstrations and exercises and a group case study.
Course material: lecture notes, book Heat Transfer Theory applied to Electronics Cooling by Lasance & Luiten.


Participants receive a High Tech Institute/T2Prof certificate.

Download as pdf

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Thermal design and cooling of electronics workshop

This course introduces thermal design and cooling of electronic components, modules and systems from an industrial point of view.

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